What is a ultra thin vapor chamber?
The ultra-thin Vapor chamber generally refers to a thickness of less than 1.5mm. The appearance of the ultra-thin vapor chamber is basically similar to the standard vapor chamber, but the internal structure is completely different.
The cooper sheet of ultra-thin vapor chamver is very thin, and because of limited inner space of ultra-thin vapor chamber, it needs to use copper etching technology to etch space for sintering copper powder or copper mesh.
There is no copper pillar support in the middle of ultra-thin vapor chamber, just join two copper sheet together by brazeing or diffusion bonding.
How the ultra thin Vapor Chamber works?Ultra-thin vapor chamber have the same working principle with standard vapor chamber, with very low pressure inside the ultra-thin vapor chamber,the fluid will be boiled and vaporized at a much lower temperature than its normal boiling temperature. When heat is applied to the vapor chamber, the fluid near that location immediately vaporizes and rushes to fill the entire volume of the chamber. When the vapor comes into contact with a cooler wall surface, it condenses, and releases its latent heat of vapor. The condensed fluid returns to the heat source by capillary force of the wick structure. The recycling of evaporating and condensing form a pumping action to move the heat from heat source area to all other areas of the ultra-thin vapor chamber, resulting in a uniform temperature distribution on ultra-thin vapor chamber's surface. 
The benefits of using a ultra-thin Vapor Chamber
Ultra-thin vapor chamber can be used in mobile phones, Pad computer and other consumer electronic devices with very narrow internal space.
The ultra-thin vapor chamber may have low heat transfer capability, but its small size and thin shape allow it to mitigate heat in constricted spaces, other solutions may be too bulky to address.
The heat of the source can be rapidly distributed to the area of the ultra-thin vapor chamber, and then the heat can be quickly dissipated through the heatsinks or the device shell.
Reliability of a Vapor Chamber
Like normal vapor chamber, the following tests are routinely performed to confirm the durability and reliability of altra-thin vapor chambers:
Thermal Shock Test
Accelerated Life Test
Freeze Thaw Test
Burst Test
Cosmetic Degradation TestDesign Guidelines?
The following table shows the suggested operation conditions for typical applications.
It is not necessarily maximize capabilities of vapor chambers when use in your application，vapor chamber provides best perfermance when its capabilities just match your demand,
Due to the highly customizable nature of ultra-thin vaporchamber design, please contact Thermsolver if you have any questions when design a ultra-thin vapor chamber.
| Vapor Chamber Ambient temperature |
0 - 85 ºC |
| Power |
5 - 30 W |
| Heat Flux |
Up to 30 W/cm2 |
| Size (width and length) |
50 to 200 mm |
| Vapor Chamber Thickness |
0.5 to 1.5mm |
| Vapor Chamber Flatness |
0.1 mm in every 25x25 mm area |
| Vapor Chamber Life (MTBF) |
80000 hours |
| Through Holes |
Allowed |
| Thermal cycling |
Tested 200 cycles between -40 and 85 ºC |
