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3D Vapor chamber for 400W LED light

Item No.: 3DVC-001
VC base size:110*90*6mm
Pipe size:D8*L120mm*N6
Power:400W
Heat flux: 31.3(W/cm2)
Heat source size:40*40mm
Industry:LED
Description
Description
What is a 3D vapor chamber?

3D vapor chamber is a composite product of standard vapor chamber and heat pipe. 

One part is the chamber of vapor chamber, the other part is the pipes of heat pipe, and the two parts are connected inside not only the space but also the wick structure, so the vapor can go from the chamber to the pipe, and the fluid also can flow back from the pipe to the chamber.The outside joints of 3D vapor chambers are joined by diffusion bonding.

How the 3D Vapor Chamber works?

3D vapor chamber have the same working principle with standard vapor chamber, with very low pressure inside the 3D vapor chamber,the fluid will be boiled and vaporized at a much lower temperature than its normal boiling temperature. When heat is applied to the vapor chamber, the fluid near that location immediately vaporizes and rushes to fill the entire volume of the chamber and the pipes. When the vapor comes into contact with a cooler wall surface, it condenses, and releases its latent heat of vapor. The condensed fluid returns to the heat source by capillary force of the wick structure. The recycling of evaporating and condensing form a pumping action to move the heat from heat source area to all other areas of the 3D vapor chamber, resulting in a uniform temperature distribution on 3d vapor chamber's surface. 


The benefits of using a 3d Vapor Chamber

3DVC has many advantages due to its structural characteristics:

First, the structure is flexible, and 3DVC is extended to space by using the structural characteristics of heat pipe, especially in narrow and irregular space;

Secondly, the steam cavity has a large space. It connects the steam cavity of the heat pipe and the soaking plate, which increases the volume of the steam cavity. The steam can reach the tail end of the heat pipe directly, reducing the thermal resistance from the soaking plate cover plate to the heat pipe;

Thirdly, the thermal resistance is relatively low. Compared with the method of soaking plate+heat pipe superposition, because the evaporation thermal resistance of the heat pipe is removed, only the evaporation thermal resistance of the soaking plate is left. The thermal resistance of 3DVC is significantly reduced, especially in the case of high power and high heat flux. The 3DVC heat conduction at low air volume is more competitive and has greater difference.

How to use a 3D vapor chamber?

3D Vapor chamber can be integrated with either aluminum or copper heatsinks. 

A more thermally efficient method is to solder a zipper fins directly to the pipes of a vapor chamber.

Due to 3D vapor chamber can have many different shape, more heatsink solutions can be used to work with 3D vapor chamber.


Design Guidelines

It is much more difficulty to design a 3D vapor chamber than standard vapor chambers or heatpipe,it is hard to give standard data for reference because there are many shapes and sizes combination of a 3D vapor chambers.

Due to the highly customizable nature of 3D vapor chamber design, please contact Thermsolver if  want to try it in your appplicaiton.
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